Question

Which of the following properties are because of presence of metallic bonding in metal atoms :
(A) Electrical conductivity
(B) Malleability
(C) Ductility
(D) All of the above

Answer 1

Hint: In metals the constituent is the sea of free electrons. Malleability is the property of metals by which they can be beaten into sheets. Ductility is the property of metals by which they can be drawn into thin wires.

Complete step to step answer:
Many attributes of metals are because of the presence of free electrons or the non localized electrons present. For example- electrical conductivity of metals is due to the presence of these free electrons which can move freely. Valence electrons move when an electric field is applied. The presence of the mobile valence electrons, as well as the non directionality of the binding force between metal ions, account for the malleability and ductility of most metals.
Malleability is the property of metals by which they can be beaten into sheets. Ductility is the property of metals by which they can be drawn into thin wires. When a metal is shaped or drawn, it does not fracture, because the ions in its crystal structure are quite easily displaced with respect to one another. Moreover, the non localized valence electrons act as a buffer between the ions of like charge and thereby prevent them from coming together and generating strong repulsive forces that can cause the crystal to fracture.
Hence option D is correct.

Additional information: Metallic bond is the chemical bond which arises due to electrostatic force of attraction between conduction bond and positively charged metal ions. Metals have high melting and boiling point. This is due to the presence of strong electrostatic force. But there are some exceptions. Metals like sodium and potassium are soft, can be cut with a knife, have low boiling point and low melting point.

Note: Metallic bond is the chemical bond which arises due to electrostatic force of attraction between conduction bond and positively charged metal ions.